The effects of cavity size and incremental technique on micro-tensile bond strength of resin composite in Class I cavities

Dent Mater. 2007 May;23(5):533-8. doi: 10.1016/j.dental.2006.03.012. Epub 2006 May 24.

Abstract

Objective: The purpose of this study was to investigate if incremental-filling technique and cavity size would affect the bond strength of resin composite.

Methods: Two sizes of Class I cavities were prepared in bovine dentin (large cavities: pi x (5/2)2 x 5 mm3; small cavity: pi x (3/2)2 x 3 mm3). Light-cure resin composite (Clearfil Photocore) with a self-etching primer adhesive (Clearfil SE Bond) was placed into the cavities by bulk filling (C-factor=5) or incremental filling (two layers, C-factor=3) and light-cured. As a control, 3 or 5mm thick resin composite was bonded to the flat dentin surface. After 24h storage in 37 degrees C water, the micro-tensile bond strength was measured at a crosshead speed of 1mm/min. The results obtained were statistically analyzed using two-way ANOVA and t-test at a significance level of P=0.05.

Results: The results obtained showed that there was no significant difference among the filling techniques in small cavities (P>0.05). However, in large cavities, bulk filling presented the lowest bond strength (P<0.05).

Significance: Not only the filling technique affected the bonding strength to the cavity floor, but the cavity size was also an influential factor in Class I cavities.

Publication types

  • Research Support, Non-U.S. Gov't

MeSH terms

  • Adhesives / chemistry
  • Adhesives / radiation effects
  • Animals
  • Bisphenol A-Glycidyl Methacrylate / chemistry
  • Bisphenol A-Glycidyl Methacrylate / radiation effects
  • Cattle
  • Composite Resins / chemistry*
  • Composite Resins / radiation effects
  • Dental Bonding*
  • Dental Cavity Preparation / classification
  • Dental Cavity Preparation / methods*
  • Dentin / ultrastructure*
  • Dentin-Bonding Agents / chemistry
  • Dentin-Bonding Agents / radiation effects
  • Light
  • Materials Testing
  • Microscopy, Electron, Scanning
  • Polyethylene Glycols / chemistry
  • Polyethylene Glycols / radiation effects
  • Polymethacrylic Acids / chemistry
  • Polymethacrylic Acids / radiation effects
  • Resin Cements / chemistry
  • Resin Cements / radiation effects
  • Stress, Mechanical
  • Surface Properties
  • Temperature
  • Tensile Strength
  • Time Factors
  • Water / chemistry

Substances

  • Adhesives
  • Clearfil SE Bond
  • Composite Resins
  • Dentin-Bonding Agents
  • Polymethacrylic Acids
  • Resin Cements
  • Water
  • triethylene glycol dimethacrylate
  • Polyethylene Glycols
  • Bisphenol A-Glycidyl Methacrylate