A multi-chip-architecture based flexible stimulation device for retinal prosthesis with a flip-chip packaging technique

T Tokuda; M Kawada; S Sugitani; M Taniyama; A Uehara; K Kagawa; M Nunoshita; J Ohta

doi:10.1109/IEMBS.2006.260794

A multi-chip-architecture based flexible stimulation device for retinal prosthesis with a flip-chip packaging technique

Conf Proc IEEE Eng Med Biol Soc. 2006:2006:2920-3. doi: 10.1109/IEMBS.2006.260794.

Authors

T Tokuda¹, M Kawada, S Sugitani, M Taniyama, A Uehara, K Kagawa, M Nunoshita, J Ohta

Affiliation

¹ Nara Inst. of Sci. & Technol., Nara, Japan. tokuda@ms.naist.jp

PMID: 17946150
DOI: 10.1109/IEMBS.2006.260794

Abstract

In the present work, we designed a multi-chip-architecture based flexible neural stimulation device for retinal prosthesis. Based on the multi-chip architecture, a novel CMOS stimulation device was successfully designed and characterized. A packaging technique for thin, flexible neural stimulation device was also proposed and demonstrated. Flip-chip bonding technology plays an essential role in the fabrication of the present thin and flexible neural stimulation device.

Publication types

Research Support, Non-U.S. Gov't

MeSH terms

Animals
Biomedical Engineering
Electric Stimulation
Electrodes, Implanted
Humans
Man-Machine Systems
Prosthesis Design*
Retina* / physiology