Photo-cross-linking-assisted thermal stability of DNA origami structures and its application for higher-temperature self-assembly

J Am Chem Soc. 2011 Sep 21;133(37):14488-91. doi: 10.1021/ja204546h. Epub 2011 Aug 29.

Abstract

Heat tolerance of DNA origami structures has been improved about 30 °C by photo-cross-linking of 8-methoxypsoralen. To demonstrate one of its applications, the cross-linked origami were used for higher-temperature self-assembly, which markedly increased the yield of the assembled product when compared to the self-assembly of non-cross-linked origami at lower-temperature. By contrast, at higher-temperature annealing, native non-cross-linked tiles did not self-assemble to yield the desired product; however, they formed a nonspecific broken structure.

Publication types

  • Research Support, Non-U.S. Gov't

MeSH terms

  • Cross-Linking Reagents / chemistry*
  • DNA / chemistry*
  • Hot Temperature
  • Methoxsalen / chemistry*
  • Nucleic Acid Conformation
  • Photochemical Processes

Substances

  • Cross-Linking Reagents
  • DNA
  • Methoxsalen