Highly conductive copper nanowires (CuNWs) are essential for efficient data transfer and heat conduction in wide ranging applications like high-performance semiconductor chips and transparent conductors. However, size scaling of CuNWs causes severe reduction in electrical and thermal conductivity due to substantial inelastic surface scattering of electrons. Here we report a novel scalable technique for low-temperature deposition of graphene around CuNWs and observe strong enhancement of electrical and thermal conductivity for graphene-encapsulated CuNWs compared to uncoated CuNWs. Fitting the experimental data with the theoretical model for conductivity of CuNWs reveals significant reduction in surface scattering of electrons at the oxide-free CuNW surfaces, translating into 15% faster data transfer and 27% lower peak temperature compared to the same CuNW without the graphene coating. Our results provide compelling evidence for improved speed and thermal management by adapting the Cu-graphene hybrid technology in future ultrascaled silicon chips and air-stable flexible electronic applications.
Keywords: Graphene; copper nanowires; electrical conductivity; graphene−copper hybrids; low-temperature graphene deposition; plasma CVD; thermal conductivity.