Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory

Do Hyun Kim; Hyeon Gyun Yoo; Sung Min Hong; Bongkyun Jang; Dae Yong Park; Daniel J Joe; Jae-Hyun Kim; Keon Jae Lee

doi:10.1002/adma.201602339

Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory

Adv Mater. 2016 Oct;28(38):8371-8378. doi: 10.1002/adma.201602339. Epub 2016 Jul 20.

Authors

Do Hyun Kim¹, Hyeon Gyun Yoo¹, Sung Min Hong², Bongkyun Jang², Dae Yong Park¹, Daniel J Joe¹, Jae-Hyun Kim³, Keon Jae Lee⁴

Affiliations

¹ Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea.
² Department of Nano Mechanics, Nano-Convergence Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-ro, Yuseong-gu, Daejeon, 305-343, Republic of Korea.
³ Department of Nano Mechanics, Nano-Convergence Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-ro, Yuseong-gu, Daejeon, 305-343, Republic of Korea. jaehkim@kimm.re.kr.
⁴ Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea. keonlee@kaist.ac.kr.

PMID: 27435480
DOI: 10.1002/adma.201602339

Abstract

Ultrathin silicon-based flexible 16 × 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 × 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections.

Keywords: flexible ACF packaging; flexible NAND flash memory; roll-to-plate technology; ultrathin silicon-based flexible electronics.