Repair of double-strand breaks in plasmid DNA in the yeast Saccharomyces cerevisiae

Mol Gen Genet. 1988 Aug;213(2-3):421-4. doi: 10.1007/BF00339611.

Abstract

We studied the repair of double-strand breaks (DSB) in plasmid DNA introduced into haploid cells of the yeast Saccharomyces cerevisiae. The efficiency of repair was estimated from the frequency of transformation of the cells by an autonomously replicated linearized plasmid. The frequency of "lithium" transformation of Rad+ cells was increased greatly (by 1 order of magnitude and more) compared with that for circular DNA if the plasmid was initially linearized at the XhoI site within the LYS2 gene. This effect is due to recombinational repair of the plasmid DNA. Mutations rad52, rad53, rad54 and rad57 suppress the repair of DSB in plasmid DNA. The kinetics of DSB repair in plasmid DNA are biphasic: the first phase is completed within 1 h and the second within 14-18 h of incubating cells on selective medium.

MeSH terms

  • DNA Repair*
  • DNA, Fungal / genetics*
  • Genes, Fungal
  • Kinetics
  • Mutation
  • Plasmids*
  • Saccharomyces cerevisiae / genetics*
  • Transformation, Genetic

Substances

  • DNA, Fungal