Carbon Nanotube Assembly and Integration for Applications

Nanoscale Res Lett. 2019 Jul 1;14(1):220. doi: 10.1186/s11671-019-3046-3.

Abstract

Carbon nanotubes (CNTs) have attracted significant interest due to their unique combination of properties including high mechanical strength, large aspect ratios, high surface area, distinct optical characteristics, high thermal and electrical conductivity, which make them suitable for a wide range of applications in areas from electronics (transistors, energy production and storage) to biotechnology (imaging, sensors, actuators and drug delivery) and other applications (displays, photonics, composites and multi-functional coatings/films). Controlled growth, assembly and integration of CNTs is essential for the practical realization of current and future nanotube applications. This review focuses on progress to date in the field of CNT assembly and integration for various applications. CNT synthesis based on arc-discharge, laser ablation and chemical vapor deposition (CVD) including details of tip-growth and base-growth models are first introduced. Advances in CNT structural control (chirality, diameter and junctions) using methods such as catalyst conditioning, cloning, seed-, and template-based growth are then explored in detail, followed by post-growth CNT purification techniques using selective surface chemistry, gel chromatography and density gradient centrifugation. Various assembly and integration techniques for multiple CNTs based on catalyst patterning, forest growth and composites are considered along with their alignment/placement onto different substrates using photolithography, transfer printing and different solution-based techniques such as inkjet printing, dielectrophoresis (DEP) and spin coating. Finally, some of the challenges in current and emerging applications of CNTs in fields such as energy storage, transistors, tissue engineering, drug delivery, electronic cryptographic keys and sensors are considered.

Keywords: Carbon nanotubes; Catalyst patterning; Chemical vapor deposition; Electronics; Integration; Self-assembly.

Publication types

  • Review