Cyanate ester (CE) resins with higher heat resistance, lower coefficients of thermal expansion (CTEs), and lower water absorption ratios are highly desired in printed circuit boards (PCBs). In this work, a CE was modified by copolymerization with a long-chain thioether bismaleimide (SBMI) to form a thioetherimide-modified CE (SBT). The results indicated that SBT had a wider processing window and better processing properties than a common bismaleimide-modified CE resin (MBMI). After molding with a glass fiber cloth, the composites (GSBT) exhibited moisture adsorption in the range of 1.4%-2.0%, high tensile strength in the range of 311-439 MPa, good mechanical retention of 70%-85% even at 200 °C, and good dimension stability, with coefficients of thermal expansion in the range of 17.3-18.6 (×10-6 m/°C). Such GSBT composites with superior properties would be good candidates for PCB applications.
Keywords: cyanate resin; dimension stability; mechanical property; moisture absorption; processability; thioetherimide.