Cotton Candy-Templated Fabrication of Three-Dimensional Ceramic Pathway within Polymer Composite for Enhanced Thermal Conductivity

Yuming Wu; Kai Ye; Zhiduo Liu; Bo Wang; Chao Yan; Zhongwei Wang; Cheng-Te Lin; Nan Jiang; Jinhong Yu

doi:10.1021/acsami.9b15758

Cotton Candy-Templated Fabrication of Three-Dimensional Ceramic Pathway within Polymer Composite for Enhanced Thermal Conductivity

ACS Appl Mater Interfaces. 2019 Nov 27;11(47):44700-44707. doi: 10.1021/acsami.9b15758. Epub 2019 Nov 12.

Authors

Yuming Wu^{1

2

3}, Kai Ye¹, Zhiduo Liu^{1

2}, Bo Wang¹, Chao Yan⁴, Zhongwei Wang⁵, Cheng-Te Lin^{1

2}, Nan Jiang^{1

2}, Jinhong Yu^{1

2}

Affiliations

¹ Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering , Chinese Academy of Sciences , Ningbo 315201 , China.
² Center of Materials Science and Optoelectronics Engineering , University of Chinese Academy of Sciences , Beijing 100049 , China.
³ School of Chemical Engineering , The University of Queensland , St. Lucia , Queensland 4072 , Australia.
⁴ School of Materials Science and Engineering , Jiangsu University of Science and Technology , Zhenjiang 212003 , China.
⁵ College of Materials Science and Engineering , Shandong University of Science and Technology , Qingdao 266590 , China.

PMID: 31670938
DOI: 10.1021/acsami.9b15758

Abstract

With the minimization and higher power of electronic devices, materials with effective heat dissipation and high electrical insulation have attracted relentless interest. Especially, highly thermally conductive, highly electrically insulating but low filler content of polymer-based composites are desirable. Herein, a facile and eco-friendly cotton candy-templated method (CTM) to construct three-dimensional heat transport pathways inside epoxy resin is reported. The fabricated Al₂O₃/epoxy composites with enhanced heat transport capability feature a 15-fold increase in thermal conductivity at a filler content of 36.2 vol % compared to pristine epoxy. Moreover, the remarkable thermal conductive property has excellent stability over a wide range of temperature before and after heating and cooling cycles. Meanwhile, the CTM composite still retain highly electrical insulation. The cotton candy-templated method proposed in this work is a new avenue for the preparation of three-dimensional heat transport pathways within polymer-based composites for microelectronic packaging and electrical engineering systems.

Keywords: alumina; cotton candy; epoxy composites; thermal conductivity.