Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics

Xiaofeng Dai; Teng Zhang; Hongbin Shi; Yabing Zhang; Tao Wang

doi:10.1021/acsomega.0c01678

Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics

ACS Omega. 2020 May 29;5(22):13416-13423. doi: 10.1021/acsomega.0c01678. eCollection 2020 Jun 9.

Authors

Xiaofeng Dai¹, Teng Zhang¹, Hongbin Shi¹, Yabing Zhang¹, Tao Wang¹

Affiliation

¹ State Key Laboratory of Chemical Engineering, Department of Chemical Engineering, Tsinghua University, Beijing 10084, P.R. China.

Abstract

A new approach is presented to overcome the disadvantages of oxidation and harsh sintering conditions of Cu nanoparticle (Cu NP) conductive inks simultaneously. In this process, oleylamine (OAM) adsorbed on particles was effectively eliminated via the reactive desorption by formic acid in alcohols; meanwhile, Cu ion was generated on the surface. The desorption of OAM resulted in more severe surface oxidation of Cu NPs. The oxide (Cu₂O) and Cu²⁺ distributed on the Cu NP surface could be reduced to Cu(0) by NaBH₄ solution and take on the role of soldering flux to weld particles into a blocky structure. With the compact coalescence of particles without oxides, the resistivity of metal patterns could fall below 20 μΩ·cm and exhibit proper adhesion. Thanks to the sintering of Cu NPs at ambient conditions, the conductive patterns could be facilely formed on thermosensitive substrates. As the oxide state of Cu would be reduced during sintering, the partially oxidized Cu nanoparticles could be directly applied to conductive inks.