For some challenging applications of the high-performance thermoplastic polyetheretherketone (PEEK) in engineering or medical fields, the bonding to other materials is important. In these cases, modifications of the inert polymer surface are often necessary. Results from the literature with respect to sandblasting, corona discharge, plasma treatment, excimer-laser irradiation, and chromium-sulfuric-acid etching are described and discussed. Our own detailed studies of these methods under well-defined experimental conditions are reported, which make their comparability possible and support the assessment for certain applications. PEEK films coated with copper are of special interest due to their potential for flexible electronics. Copper foils glued by an epoxy resin and copper layers from physical vapor deposition are compared with respect to their mechanical adhesion. Surface properties were characterized with respect to roughness, contact angle, and oxygen-to-carbon (O/C) ratio. The latter has been found to be the most decisive parameter for good adhesion. It was shown that an enhancement of the O/C ratio can be achieved in several ways. The advantages and disadvantages of the methods applied are discussed under various aspects of applications.
Keywords: bonding properties; copper layers; polyetheretherketone; surface analysis; surface treatment.