Advanced Electronic Packaging Technology: From Hard to Soft

Materials (Basel). 2023 Mar 15;16(6):2346. doi: 10.3390/ma16062346.

Authors

Yue Gu^{1

2}, Yongjun Huo¹

Affiliations

¹ School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China.
² Department of Neurosurgery, Yale University, New Haven, CT 06520, USA.

Abstract

Packaging is a pivotal step in electronic device manufacturing, determining the translational performance of bare chips [...].

Publication types

Editorial

Grants and funding

52203371/National Natural Science Foundation of China