Flexible and Robust Functionalized Boron Nitride/Poly(p-Phenylene Benzobisoxazole) Nanocomposite Paper with High Thermal Conductivity and Outstanding Electrical Insulation

Lin Tang; Kunpeng Ruan; Xi Liu; Yusheng Tang; Yali Zhang; Junwei Gu

doi:10.1007/s40820-023-01257-5

Flexible and Robust Functionalized Boron Nitride/Poly(p-Phenylene Benzobisoxazole) Nanocomposite Paper with High Thermal Conductivity and Outstanding Electrical Insulation

Nanomicro Lett. 2023 Nov 30;16(1):38. doi: 10.1007/s40820-023-01257-5.

Authors

Lin Tang¹, Kunpeng Ruan², Xi Liu¹, Yusheng Tang³, Yali Zhang², Junwei Gu⁴

Affiliations

¹ Chongqing Key Laboratory of Green Synthesis and Applications, College of Chemistry, Chongqing Normal University, Chongqing, 401331, People's Republic of China.
² Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, 710072, People's Republic of China.
³ Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, 710072, People's Republic of China. tys@nwpu.edu.cn.
⁴ Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, 710072, People's Republic of China. gjw@nwpu.edu.cn.

Abstract

With the rapid development of 5G information technology, thermal conductivity/dissipation problems of highly integrated electronic devices and electrical equipment are becoming prominent. In this work, "high-temperature solid-phase & diazonium salt decomposition" method is carried out to prepare benzidine-functionalized boron nitride (m-BN). Subsequently, m-BN/poly(p-phenylene benzobisoxazole) nanofiber (PNF) nanocomposite paper with nacre-mimetic layered structures is prepared via sol-gel film transformation approach. The obtained m-BN/PNF nanocomposite paper with 50 wt% m-BN presents excellent thermal conductivity, incredible electrical insulation, outstanding mechanical properties and thermal stability, due to the construction of extensive hydrogen bonds and π-π interactions between m-BN and PNF, and stable nacre-mimetic layered structures. Its λ_∥ and λ_⊥ are 9.68 and 0.84 W m^-1 K^-1, and the volume resistivity and breakdown strength are as high as 2.3 × 10¹⁵ Ω cm and 324.2 kV mm^-1, respectively. Besides, it also presents extremely high tensile strength of 193.6 MPa and thermal decomposition temperature of 640 °C, showing a broad application prospect in high-end thermal management fields such as electronic devices and electrical equipment.

Keywords: Boron nitride; Electrical insulation; Poly(p-phenylene-2,6-benzobisoxazole) nanofiber; Thermal conductivity.