The escalating thermal power density in electronic devices necessitates advanced thermal management technologies. Polymer-based materials, prized for their electrical insulation, flexibility, light weight, and strength, are extensively used in this field. However, the inherent low thermal conductivity of polymers requires enhancement for effective heat dissipation. This work proposes a novel paradigm, emphasizing ordered structures with functional units, to create triple-level, ordered, low-filler loading of multi-walled carbon nanotube (MWCNT)/poly(vinyl alcohol)(PVA) nanofibrous films. By addressing interfacial thermal resistance through -OH groups, the coupling between polymer and MWCNT is strengthened. The triple-level ordered structure comprises aligned PVA chains, aligned MWCNTs, and aligned MWCNT/PVA composite fibers. Focusing on the filler's impact on thermal conductivity and chain orientation, the thermal transport mechanisms have been elucidated level by level. Our MWCNT/PVA composite, with lower filler loadings (10 wt.%), achieves a remarkable TC exceeding 35.4 W/(m·K), surpassing other PVA composites with filler loading below 50 wt.%.
Keywords: Angstrom method; poly(vinyl alcohol)-based materials; thermal management.