Correction: Arshad et al. A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties. Micromachines 2022, 13, 1513

Correction: Arshad et al. A Comparative Modelling Study of New Robust Packaging Technology 1 mm² VCSEL Packages and Their Mechanical Stress Properties. Micromachines 2022, 13, 1513

Micromachines (Basel). 2025 Mar 28;16(4):390. doi: 10.3390/mi16040390.

Khairul Mohd Arshad¹, Muhamad Mat Noor², Asrulnizam Abd Manaf³, Hiroshi Kawarada^{4

5}, Shaili Falina^{3

4}, Mohd Syamsul^{1

4}

¹ Institute of Nano Optoelectronics Research and Technology (INOR), Universiti Sains Malaysia, Sains@USM, Bayan Lepas 11900, Pulau Pinang, Malaysia.
² Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Pahang, Malaysia.
³ Collaborative Microelectronic Design Excellence Centre (CEDEC), Universiti Sains Malaysia, Sains@USM, Bayan Lepas 11900, Pulau Pinang, Malaysia.
⁴ Faculty of Science and Engineering, Waseda University, Shinjuku, Tokyo 169-8555, Japan.
⁵ The Kagami Memorial Laboratory for Materials Science and Technology, Waseda University, 2-8-26 Nishiwaseda, Shinjuku, Tokyo 169-0051, Japan.

In the original publication [...].