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Page 1
Tactile Sensing Using Magnetic Foam.
Polymers (Basel). 2022 Feb 21;14(4):834. doi: 10.3390/polym14040834.
Polymers (Basel). 2022.
PMID: 35215750
Free PMC article.
Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding.
Tanaka K, Wang WS, Baum M, Froemel J, Hirano H, Tanaka S, Wiemer M, Otto T.
Tanaka K, et al. Among authors: froemel j.
Micromachines (Basel). 2016 Dec 15;7(12):234. doi: 10.3390/mi7120234.
Micromachines (Basel). 2016.
PMID: 30404406
Free PMC article.
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Micromechanical Force Sensor Using the Stress-Impedance Effect of Soft Magnetic FeCuNbSiB.
Froemel J, Diguet G, Muroyama M.
Froemel J, et al.
Sensors (Basel). 2021 Nov 15;21(22):7578. doi: 10.3390/s21227578.
Sensors (Basel). 2021.
PMID: 34833661
Free PMC article.
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Simple Device to Measure Pressure Using the Stress Impedance Effect of Amorphous Soft Magnetic Thin Film.
Froemel J, Akita S, Tanaka S.
Froemel J, et al.
Micromachines (Basel). 2020 Jun 30;11(7):649. doi: 10.3390/mi11070649.
Micromachines (Basel). 2020.
PMID: 32629856
Free PMC article.
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Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames.
Tanaka K, Hirano H, Kumano M, Froemel J, Tanaka S.
Tanaka K, et al. Among authors: froemel j.
Micromachines (Basel). 2018 Apr 13;9(4):181. doi: 10.3390/mi9040181.
Micromachines (Basel). 2018.
PMID: 30424114
Free PMC article.
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