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Year Number of Results
2013 3
2014 1
2015 2
2016 1
2018 1
2022 0
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Page 1
Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper.
Wen LG, Roussel P, Pedreira OV, Briggs B, Groven B, Dutta S, Popovici MI, Heylen N, Ciofi I, Vanstreels K, Østerberg FW, Hansen O, Petersen DH, Opsomer K, Detavernie C, Wilson CJ, Elshocht SV, Croes K, Bömmels J, Tőkei Z, Adelmann C. Wen LG, et al. Among authors: opsomer k. ACS Appl Mater Interfaces. 2016 Oct 5;8(39):26119-26125. doi: 10.1021/acsami.6b07181. Epub 2016 Sep 21. ACS Appl Mater Interfaces. 2016. PMID: 27598509
Ultrathin NiGe films prepared via catalytic solid-vapor reaction of Ni with GeH(4).
Peter AP, Opsomer K, Adelmann C, Schaekers M, Meersschaut J, Richard O, Vaesen I, Moussa A, Franquet A, Zsolt T, Van Elshocht S. Peter AP, et al. Among authors: opsomer k. ACS Appl Mater Interfaces. 2013 Oct 9;5(19):9605-14. doi: 10.1021/am4024719. Epub 2013 Sep 19. ACS Appl Mater Interfaces. 2013. PMID: 23992550
Influence of carbon alloying on the thermal stability and resistive switching behavior of copper-telluride based CBRAM cells.
Devulder W, Opsomer K, Seidel F, Belmonte A, Muller R, De Schutter B, Bender H, Vandervorst W, Van Elshocht S, Jurczak M, Goux L, Detavernier C. Devulder W, et al. Among authors: opsomer k. ACS Appl Mater Interfaces. 2013 Aug 14;5(15):6984-9. doi: 10.1021/am4010946. Epub 2013 Jul 17. ACS Appl Mater Interfaces. 2013. PMID: 23826667