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Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration.
Braun T, Becker KF, Hoelck O, Voges S, Kahle R, Dreissigacker M, Schneider-Ramelow M. Braun T, et al. Among authors: dreissigacker m. Micromachines (Basel). 2019 May 23;10(5):342. doi: 10.3390/mi10050342. Micromachines (Basel). 2019. PMID: 31126083 Free PMC article.
On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers.
Roshanghias A, Dreissigacker M, Scherf C, Bretthauer C, Rauter L, Zikulnig J, Braun T, Becker KF, Rzepka S, Schneider-Ramelow M. Roshanghias A, et al. Among authors: dreissigacker m. Micromachines (Basel). 2020 May 31;11(6):564. doi: 10.3390/mi11060564. Micromachines (Basel). 2020. PMID: 32486457 Free PMC article.