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2019 3
2020 1
2021 2
2022 0
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Page 1
Diamond-Like-Carbon Coated Dies for Electromagnetic Embossing.
Herrmann M, Beckschwarte B, Hasselbruch H, Heidhoff J, Schenck C, Riemer O, Mehner A, Kuhfuss B. Herrmann M, et al. Among authors: riemer o. Materials (Basel). 2020 Nov 3;13(21):4939. doi: 10.3390/ma13214939. Materials (Basel). 2020. PMID: 33153136 Free PMC article.
Descriptors for High Throughput in Structural Materials Development.
Steinbacher M, Alexe G, Baune M, Bobrov I, Bösing I, Clausen B, Czotscher T, Epp J, Fischer A, Langstädtler L, Meyer D, Raj Menon S, Riemer O, Sonnenberg H, Thomann A, Toenjes A, Vollertsen F, Wielki N, Ellendt N. Steinbacher M, et al. Among authors: riemer o. High Throughput. 2019 Dec 5;8(4):22. doi: 10.3390/ht8040022. High Throughput. 2019. PMID: 31817488 Free PMC article.