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2018 1
2021 0
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Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays.
Lin DS, Wodnicki R, Zhuang X, Woychik C, Thomenius KE, Fisher RA, Mills DM, Byun AJ, Burdick W, Khuri-Yakub P, Bonitz B, Davies T, Thomas G, Otto B, Töpper M, Fritzsch T, Ehrmann O. Lin DS, et al. Among authors: ehrmann o. IEEE Trans Ultrason Ferroelectr Freq Control. 2013 Jul;60(7):1356-75. doi: 10.1109/TUFFC.2013.2709. IEEE Trans Ultrason Ferroelectr Freq Control. 2013. PMID: 25004504