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Results by year
Table representation of search results timeline featuring number of search results per year.
Year | Number of Results |
---|---|
2021 | 1 |
2022 | 3 |
2023 | 0 |
Search Results
4
results
Results by year
Page 1
Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects.
Int J Mol Sci. 2022 Feb 8;23(3):1891. doi: 10.3390/ijms23031891.
Int J Mol Sci. 2022.
PMID: 35163817
Free PMC article.
Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis.
Oliveira BMC, Santos RF, Piedade AP, Ferreira PJ, Vieira MF.
Oliveira BMC, et al. Among authors: santos rf.
Nanomaterials (Basel). 2022 May 20;12(10):1752. doi: 10.3390/nano12101752.
Nanomaterials (Basel). 2022.
PMID: 35630972
Free PMC article.
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Seedless Cu Electroplating on Co-W Thin Films in Low pH Electrolyte: Early Stages of Formation.
Santos RF, Oliveira BMC, Chícharo A, Alpuim P, Ferreira PJ, Simões S, Viana F, Vieira MF.
Santos RF, et al.
Nanomaterials (Basel). 2021 Jul 25;11(8):1914. doi: 10.3390/nano11081914.
Nanomaterials (Basel). 2021.
PMID: 34443745
Free PMC article.
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The Effect of Ultrasonic Agitation on the Seedless Growth of Cu on Ru-W Thin Films.
Santos RF, Oliveira BMC, Ferreira PJ, Vieira MF.
Santos RF, et al.
Materials (Basel). 2022 Dec 24;16(1):167. doi: 10.3390/ma16010167.
Materials (Basel). 2022.
PMID: 36614506
Free PMC article.
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