Truly form-factor-free industrially scalable system integration for electronic textile architectures with multifunctional fiber devices.
Lee S, Choi HW, Figueiredo CL, Shin DW, Moncunill FM, Ullrich K, Sinopoli S, Jovančić P, Yang J, Lee H, Eisenreich M, Emanuele U, Nicotera S, Santos A, Igreja R, Marrani A, Momentè R, Gomes J, Jung SM, Han SD, Bang SY, Zhan S, Harden-Chaters W, Suh YH, Fan XB, Lee TH, Jo JW, Kim Y, Costantino A, Candel VG, Durães N, Meyer S, Kim CH, Lucassen M, Nejim A, Jiménez D, Springer M, Lee YW, An GH, Choi Y, Sohn JI, Cha S, Chhowalla M, Amaratunga GAJ, Occhipinti LG, Barquinha P, Fortunato E, Martins R, Kim JM.
Lee S, et al. Among authors: jung sm.
Sci Adv. 2023 Apr 21;9(16):eadf4049. doi: 10.1126/sciadv.adf4049. Epub 2023 Apr 21.
Sci Adv. 2023.
PMID: 37083532
Free PMC article.