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Year Number of Results
2011 2
2012 1
2013 1
2017 1
2019 4
2020 3
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11 results
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Moiré-Based Alignment Using Centrosymmetric Grating Marks for High-Precision Wafer Bonding.
Huang B, Wang C, Fang H, Zhou S, Suga T. Huang B, et al. Among authors: suga t. Micromachines (Basel). 2019 May 22;10(5):339. doi: 10.3390/mi10050339. Micromachines (Basel). 2019. PMID: 31121955 Free PMC article.
Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au⁻Au Bonding Using Ultrathin Au Films.
Yamamoto M, Matsumae T, Kurashima Y, Takagi H, Suga T, Itoh T, Higurashi E. Yamamoto M, et al. Among authors: suga t. Micromachines (Basel). 2019 Feb 13;10(2):119. doi: 10.3390/mi10020119. Micromachines (Basel). 2019. PMID: 30781779 Free PMC article.
High Thermal Boundary Conductance across Bonded Heterogeneous GaN-SiC Interfaces.
Mu F, Cheng Z, Shi J, Shin S, Xu B, Shiomi J, Graham S, Suga T. Mu F, et al. Among authors: suga t. ACS Appl Mater Interfaces. 2019 Sep 11;11(36):33428-33434. doi: 10.1021/acsami.9b10106. Epub 2019 Aug 28. ACS Appl Mater Interfaces. 2019. PMID: 31408316
Wafer Bonding of SiC-AlN at Room Temperature for All-SiC Capacitive Pressure Sensor.
Mu F, Xu Y, Shin S, Wang Y, Xu H, Shang H, Sun Y, Yue L, Tsuyuki T, Suga T, Wang W, Chen D. Mu F, et al. Among authors: suga t. Micromachines (Basel). 2019 Sep 23;10(10):635. doi: 10.3390/mi10100635. Micromachines (Basel). 2019. PMID: 31547592 Free PMC article.
Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment.
Xu Y, Wang C, Li L, Matsumoto N, Jang K, Dong Y, Mawatari K, Suga T, Kitamori T. Xu Y, et al. Among authors: suga t. Lab Chip. 2013 Mar 21;13(6):1048-52. doi: 10.1039/c3lc41345d. Lab Chip. 2013. PMID: 23377319
Single-Crystalline 3C-SiC anodically Bonded onto Glass: An Excellent Platform for High-Temperature Electronics and Bioapplications.
Phan HP, Cheng HH, Dinh T, Wood B, Nguyen TK, Mu F, Kamble H, Vadivelu R, Walker G, Hold L, Iacopi A, Haylock B, Dao DV, Lobino M, Suga T, Nguyen NT. Phan HP, et al. Among authors: suga t. ACS Appl Mater Interfaces. 2017 Aug 23;9(33):27365-27371. doi: 10.1021/acsami.7b06661. Epub 2017 Aug 15. ACS Appl Mater Interfaces. 2017. PMID: 28792726
Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices.
Cheng Z, Mu F, Yates L, Suga T, Graham S. Cheng Z, et al. Among authors: suga t. ACS Appl Mater Interfaces. 2020 Feb 19;12(7):8376-8384. doi: 10.1021/acsami.9b16959. Epub 2020 Feb 10. ACS Appl Mater Interfaces. 2020. PMID: 31986013
Low-temperature direct bonding of glass nanofluidic chips using a two-step plasma surface activation process.
Xu Y, Wang C, Dong Y, Li L, Jang K, Mawatari K, Suga T, Kitamori T. Xu Y, et al. Among authors: suga t. Anal Bioanal Chem. 2012 Jan;402(3):1011-8. doi: 10.1007/s00216-011-5574-2. Epub 2011 Dec 3. Anal Bioanal Chem. 2012. PMID: 22134493
Air-gap structure between integrated LiNbO3 optical modulators and micromachined Si substrates.
Takigawa R, Higurashi E, Suga T, Kawanishi T. Takigawa R, et al. Among authors: suga t. Opt Express. 2011 Aug 15;19(17):15739-49. doi: 10.1364/OE.19.015739. Opt Express. 2011. PMID: 21934936
Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding.
Yamamoto M, Matsumae T, Kurashima Y, Takagi H, Suga T, Takamatsu S, Itoh T, Higurashi E. Yamamoto M, et al. Among authors: suga t. Micromachines (Basel). 2020 Apr 27;11(5):454. doi: 10.3390/mi11050454. Micromachines (Basel). 2020. PMID: 32349451 Free PMC article.
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