Tzai-Liang Tzeng - Search Results

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Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging.

Lee CC, Tzeng TL, Huang PC. Lee CC, et al. Among authors: tzeng tl. Materials (Basel). 2015 Aug 7;8(8):5121-5137. doi: 10.3390/ma8085121. Materials (Basel). 2015. PMID: 28793495 Free PMC article.

A Resultant Stress Effect of Contact Etching Stop Layer and Geometrical Designs of Poly Gate on Nanoscaled nMOSFETs with a Si1-xGe(x) Channel.

Lee CC, Liu CH, Chen ZH, Tzeng TL. Lee CC, et al. Among authors: tzeng tl. J Nanosci Nanotechnol. 2015 Mar;15(3):2173-8. doi: 10.1166/jnn.2015.10227. J Nanosci Nanotechnol. 2015. PMID: 26413636

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