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Reliability issues of lead-free solder joints in electronic devices.
Jiang N, Zhang L, Liu ZQ, Sun L, Long WM, He P, Xiong MY, Zhao M. Jiang N, et al. Sci Technol Adv Mater. 2019 Jul 11;20(1):876-901. doi: 10.1080/14686996.2019.1640072. eCollection 2019. Sci Technol Adv Mater. 2019. PMID: 31528239 Free PMC article. Review.