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Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography.
Blaicher M, Billah MR, Kemal J, Hoose T, Marin-Palomo P, Hofmann A, Kutuvantavida Y, Kieninger C, Dietrich PI, Lauermann M, Wolf S, Troppenz U, Moehrle M, Merget F, Skacel S, Witzens J, Randel S, Freude W, Koos C. Blaicher M, et al. Light Sci Appl. 2020 Apr 27;9:71. doi: 10.1038/s41377-020-0272-5. eCollection 2020. Light Sci Appl. 2020. PMID: 32351695 Free PMC article.
3D-printed optical probes for wafer-level testing of photonic integrated circuits.
Trappen M, Blaicher M, Dietrich PI, Dankwart C, Xu Y, Hoose T, Billah MR, Abbasi A, Baets R, Troppenz U, Theurer M, Wörhoff K, Seyfried M, Freude W, Koos C. Trappen M, et al. Among authors: blaicher m. Opt Express. 2020 Dec 7;28(25):37996-38007. doi: 10.1364/OE.405139. Opt Express. 2020. PMID: 33379622
3D-M3: high-spatial-resolution spectroscopy with extreme AO and 3D-printed micro-lenslets.
Anagnos T, Trappen M, Tiong BCK, Feger T, Yerolatsitis S, Harris RJ, Lozi J, Jovanovic N, Birks TA, Vievard S, Guyon O, Gris-Sánchez I, Leon-Saval SG, Norris B, Haffert SY, Hottinger P, Blaicher M, Xu Y, Betters CH, Koos C, Coutts DW, Schwab C, Quirrenbach A. Anagnos T, et al. Among authors: blaicher m. Appl Opt. 2021 Jul 1;60(19):D108-D121. doi: 10.1364/AO.420855. Appl Opt. 2021. PMID: 34263844