Instant tough bonding of hydrogels for soft machines and electronics.
Wirthl D, Pichler R, Drack M, Kettlguber G, Moser R, Gerstmayr R, Hartmann F, Bradt E, Kaltseis R, Siket CM, Schausberger SE, Hild S, Bauer S, Kaltenbrunner M.
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Sci Adv. 2017 Jun 21;3(6):e1700053. doi: 10.1126/sciadv.1700053. eCollection 2017 Jun.
Sci Adv. 2017.
PMID: 28691092
Free PMC article.