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Reliability issues of lead-free solder joints in electronic devices.
Jiang N, Zhang L, Liu ZQ, Sun L, Long WM, He P, Xiong MY, Zhao M. Jiang N, et al. Among authors: long wm. Sci Technol Adv Mater. 2019 Jul 11;20(1):876-901. doi: 10.1080/14686996.2019.1640072. eCollection 2019. Sci Technol Adv Mater. 2019. PMID: 31528239 Free PMC article. Review.
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