In-Situ Orthogonal TEM Lamella Conversion for Catching Subtle Defects in 3D Transistors of Microprocessor Devices
Microsc Microanal
.
2023 Jul 22;29(Supplement_1):161-162.
doi: 10.1093/micmic/ozad067.072.
Authors
Dionaldo Zudhistira
1
,
Mun-Yee Ho
1
,
Vinod Narang
1
Affiliation
1
Advanced Micro Devices, Device Analysis Lab, Singapore.
PMID:
37613041
DOI:
10.1093/micmic/ozad067.072
No abstract available