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Gopman DB, Dennis CL, McMichael RD, Hao X, Wang Z, Wang X, Gan H, Zhou Y, Zhang J, Huai Y.Gopman DB, et al. Among authors: dennis cl.AIP Adv. 2017 Mar;7(5):055932. doi: 10.1063/1.4977969. Epub 2017 Mar 3.AIP Adv. 2017.PMID: 28690916Free PMC article.
Boekelheide Z, Dennis CL.Boekelheide Z, et al. Among authors: dennis cl.AIP Adv. 2016 Aug;6(8):085201. doi: 10.1063/1.4960457. Epub 2016 Aug 1.AIP Adv. 2016.PMID: 28758049Free PMC article.
Bui TQ, Biacchi AJ, Dennis CL, Tew WL, Walker ARH, Woods SI.Bui TQ, et al. Among authors: dennis cl.Appl Phys Lett. 2022;120(1):10.1063/5.0077016. doi: 10.1063/5.0077016.Appl Phys Lett. 2022.PMID: 36590240Free PMC article.
Dennis CL, Jackson AJ, Borchers JA, Gruettner C, Ivkov R.Dennis CL, et al.Nanotechnology. 2018 May 25;29(21):215705. doi: 10.1088/1361-6528/aab31d. Epub 2018 Mar 1.Nanotechnology. 2018.PMID: 29493534
Matsumoto N, Dennis CL, Shull RD.Matsumoto N, et al. Among authors: dennis cl.IEEE Trans Magn. 2019 Feb;55(2):10.1109/tmag.2018.2867477. doi: 10.1109/tmag.2018.2867477.IEEE Trans Magn. 2019.PMID: 38486836Free PMC article.
Cheng G, Dennis CL, Shull RD, Walker AR.Cheng G, et al. Among authors: dennis cl.Langmuir. 2007 Nov 6;23(23):11740-6. doi: 10.1021/la7010887. Epub 2007 Oct 9.Langmuir. 2007.PMID: 17924670
Dagata JA, Farkas N, Dennis CL, Shull RD, Hackley VA, Yang C, Pirollo KF, Chang EH.Dagata JA, et al. Among authors: dennis cl.Nanotechnology. 2008 Jul 30;19(30):305101. doi: 10.1088/0957-4484/19/30/305101. Epub 2008 Jun 12.Nanotechnology. 2008.PMID: 21828753
Pajerowski DM, Li Q, Hyun J, Dennis CL, Phelan D, Yan P, Chen P, Li G.Pajerowski DM, et al. Among authors: dennis cl.Dalton Trans. 2014 Aug 21;43(31):11973-80. doi: 10.1039/c4dt01329h.Dalton Trans. 2014.PMID: 24970397