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Page 1
3-D Design and Simulation of a Piezoelectric Micropump.
Micromachines (Basel). 2019 Apr 18;10(4):259. doi: 10.3390/mi10040259.
Micromachines (Basel). 2019.
PMID: 31003481
Free PMC article.
A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer.
Farshchi Yazdi SAF, Garavaglia M, Ghisi A, Corigliano A.
Farshchi Yazdi SAF, et al.
Micromachines (Basel). 2021 Mar 26;12(4):361. doi: 10.3390/mi12040361.
Micromachines (Basel). 2021.
PMID: 33810581
Free PMC article.
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An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding.
Farshchi Yazdi SAF, Garavaglia M, Ghisi A, Corigliano A.
Farshchi Yazdi SAF, et al.
Micromachines (Basel). 2023 Jan 8;14(1):165. doi: 10.3390/mi14010165.
Micromachines (Basel). 2023.
PMID: 36677226
Free PMC article.
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